About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Novel Liquid Metal Thermal Interface Material with High Thermal Conductivity and Viscosity |
| Author(s) |
Chih-En Hsu, Cheng-Yi Liu |
| On-Site Speaker (Planned) |
Chih-En Hsu |
| Abstract Scope |
Escalating power demands in electronics highlight conventional thermal interface materials' (TIMs) shortcomings in thermal stability and interfacial affinity. Liquid metals (LMs), with superior thermal conductivity, low melting points, and adaptability, are promising for advanced thermal management in semiconductors and high-power electronics. Thus, developing novel, highly efficient LM-based TIMs is imperative.
This study develops high-viscosity, high-thermal-conductivity LM-TIMs for stable application in high-power packaging modules. Systematic testing of a high-conductivity filler demonstrated excellent compatibility with LMs. This filler concurrently enhances both thermal conductivity and viscosity, significantly mitigating LM leakage.
This project aims to: (1) formulate high-viscosity, high-thermal-conductivity LM compositions; (2) investigate filler parameters' influence on microstructure and properties; and (3) validate performance and reliability under actual high-power conditions. We anticipate developing composite TIMs exceeding 70 W/m·K, providing a critical material solution for future high-heat-flux components. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Composites, Electronic Materials, Thin Films and Interfaces |