About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Ultrafine-Grained and Heterostructured Materials (UFGH) XIV
|
| Presentation Title |
Ultrasonic Contact Impedance Measurements at Nanometer Scale |
| Author(s) |
Antanas Daugela |
| On-Site Speaker (Planned) |
Antanas Daugela |
| Abstract Scope |
Ultrasonic microhardness aka Ultrasonic Contact Impedance (UCI) testers have been around since 1970s. While UCI microhardness testers relied on microscale contact elastic deformation, at nanoscale this technique has new applications in the area of multi-cycle nanofatigue monitoring. In addition, the theoretical contact mechanical impedance models suggest new applicability ranges at the nanometer scale.
The newly developed instrumentation consisting of the ultrasonic nanoindentation tip integrated into a conventional nanomechancal test instrument delivers millions of precisely placed loading cycles within seconds. Thin film breakthrough induced nanoindentation displacement excursions and simultaneously monitored ultrasonic signals indicate fatigue failure and provide the number of failure cycles. Those nanofatigue cycles are statistically tied to the film performance parameters such as fracture toughness. Nanoscale contact workhardening and plasticity monitoring experiments can be conducted with the new instruments potentially expanding its reach to the Ultrafine-Grained and Heterostructured Materials. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Mechanical Properties, |