About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
High Thermal Conductivity Jelly-Like Liquid Metal TIMs |
| Author(s) |
ZhongYen Yu, ChengYi Liu |
| On-Site Speaker (Planned) |
ZhongYen Yu |
| Abstract Scope |
Gallium-based liquid metals (Ga-based LMs) have emerged as promising next-generation thermal interface materials (TIMs) in the semiconductor industry, owing to their outstanding thermal conductivity and excellent interfacial contact. Nevertheless, their intrinsic liquid state leads to challenges such as leakage and poor mechanical stability during packaging processes and operation environments. In this study, we propose a filler-enhanced LM composite strategy by incorporating thermally conductive particles to modulate the rheological behavior of LMs. The resulting material not only retains high thermal conductivity but also exhibits conformable and deformable characteristics, enabling reliable integration into a wide variety of packaging configurations and expanding the applicability of LM-based TIMs in advanced electronic systems. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Characterization, Composites |