About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Characterization of Minerals, Metals and Materials 2026 - In-Situ Characterization Techniques
|
| Presentation Title |
Thermal Conductivity Evolution of Porous Sintered Ag/Cu Bilayers During Thermal Aging |
| Author(s) |
BILLAUD Yann, SGHURI Anas, SAURY Didier, MILHET Xavier |
| On-Site Speaker (Planned) |
BILLAUD Yann |
| Abstract Scope |
The thermal conductivity of porous sintered Ag deposited onto a Cu substrate has been investigated using an original 3D Flash set-up. The impact of the evolution of the Cu/Ag interface on the thermal conductivity of the bilayer was monitored during thermal aging at various temperatures. For every aging temperature, an increase in thermal conductivity is observed until a time threshold after which it decreases well below the initial value. This is discussed based on the evolution of both the interface and the Ag porous structure close to the interface. This preliminary study proves important for taking into account the interface evolution in the aging of power modules and is a first step toward obtaining objective data on the behavior at the layer scale. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Electronic Materials, Thin Films and Interfaces |