About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
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| Symposium
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Electronic Packaging and Interconnection Materials III
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| Presentation Title |
Microstructural Evolution in Sn-Bi Pb-free Solders
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| Author(s) |
Nikhilesh Chawla |
| On-Site Speaker (Planned) |
Nikhilesh Chawla |
| Abstract Scope |
Sn-Bi alloys are being developed because of their lower melting point compared to other Sn-based alloys. In this talk I will cover in situ solidification of Sn-Bi alloys using simultaneous 4D X-ray synchrotron Microcomputed Tomography (XCT) and Energy Dispersive Diffraction (EDD) . The microtomography analysis revealed the morphological changes and growth kinetics, while the EDD investigation provided the information regarding phase composition and lattice strain. The second part of my talk will focus on thermal aging studies focusing on precipitation of Bi driven by surface diffusion. I will present results from a systematic observation of surface precipitation in Sn-7Bi solder alloy. The precise nature of mechanisms associated with precipitation will also be discussed.
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| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Electronic Materials, |