About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Microstructure-Sensitive Design and Advanced Characterization: An MPMD/SMD Symposium Honoring David T. Fullwood
|
| Presentation Title |
Capacitive MEMS Accelerometer for Hypersonic Applications |
| Author(s) |
Logan DiFiore, Brett Freidkes, Ashok Kumar |
| On-Site Speaker (Planned) |
Logan DiFiore |
| Abstract Scope |
Understanding the mechanical behavior of silicon microstructures under extreme high-g loading is critical for the advancement of sensors in aerospace applications. This research presents the design and validation of a novel capacitive accelerometer. Integration of analytical modeling techniques, such as utilization of Euler-Bernoulli beam theory and Rayleigh-Ritz method, in combination with finite element analysis (FEA) allowed for the modeling of both the mechanical and electrical behaviors under severe deformation and impact. The sensor geometry was optimized using these models to achieve targeted performance coupled with high-g survivability. To validate these models, physical prototypes are currently being fabricated via bulk micromachining of traditional silicon wafers. Further testing will evaluate proof-mass mobility and electrical separation to verify device functionality. This research aims to bridge the gap between computational modeling and experimental validation to advance the understanding of microstructure performance in high-impact aerospace applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Mechanical Properties, Modeling and Simulation |