About this Abstract |
| Meeting |
TMS Specialty Congress 2026
|
| Symposium
|
World Congress on Reproducibility, Qualification, and Standards Development of Additive Manufacturing and Beyond (RQSD 2026)
|
| Presentation Title |
High-Precision Materials Thermophysical Property Databases |
| Author(s) |
Matthew John Luebbe, Zhi Liang, Ursula Kattner, Fan Zhang |
| On-Site Speaker (Planned) |
Matthew John Luebbe |
| Abstract Scope |
Warpage is a significant factor impacting semiconductor manufacturing yield and efficiency, primarily due to thermal expansion mismatches across interfaces during processes like chemical mechanical planarization and packaging. Warpage engineering requires accurate thermal management, in which high-precision thermal conductivity and expansivity of the related materials are essential, yet these properties are temperature-, composition-, and microstructure-dependent. In this CHIPS Metrology R&D project, they are addressed by developing a high-precision thermophysical property database via Calculation of Phase Diagram (CALPHAD) methodology, which employs physics-based models to predict properties across complex composition and temperature spaces. With various high-precision thermophysical property measurements, this CALPHAD database is capable of extrapolating data for various microstructures and regimes with robust physics basis. Using 6xxx aluminum alloys and SiC as proof-of-concept systems, this work offers industries a time- and cost-efficient alternative to traditional trial-and-error methods by bridging the gap between multi-scale modeling and industrial application. |
| Proceedings Inclusion? |
Undecided |