About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
A Comprehensive Study on the Thermal Behaviors of Diamond/Silver Metal Matrix Composites for Enhanced Thermal Management of Electronics |
| Author(s) |
Weng Man Cheang, Yuan-Han Ku, C. Robert Kao |
| On-Site Speaker (Planned) |
Weng Man Cheang |
| Abstract Scope |
As electronic devices continue to evolve rapidly, the demand for miniaturization of high-performance chips has been increasing. Smaller chip sizes often exacerbate thermal accumulation issues, causing device damages or failures. Heat spreaders play a crucial role by distributing heat uniformly. In recent years, diamond metal matrix composites have emerged as promising interconnecting materials due to diamond’s exceptionally high thermal conductivity, which facilitates rapid heat transfer. In this study, the thermal dissipation capability of diamond/silver matrix composites is investigated. The effects of various factors on thermal conductivity are examined, including the volume fraction of diamond particles, the morphology of the silver particles, and the porosity of the specimens. Additionally, surface modification of diamond—such as air plasma pretreatment and surface coating—will be explored to determine the optimal treatment method. Cross-sectional morphologies of the composites will also be analyzed to evaluate the interfacial bonding and wetting between silver and diamond. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Surface Modification and Coatings, Composites, Powder Materials |