About this Abstract |
Meeting |
2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
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Symposium
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2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
|
Presentation Title |
3D Transient Thermal Simulation for Wire-Arc Additive Manufacturing of Inconel 718 |
Author(s) |
Recheng Wang, Santosh Rauniyar, Ben Xu |
On-Site Speaker (Planned) |
Recheng Wang |
Abstract Scope |
Wire Arc Additive Manufacturing (WAAM) is an advanced metal 3D printing technology that builds large and complex parts by melting a metal wire with an electric arc and depositing it layer by layer. WAAM offers high deposition rates, low material costs, and is well-suited for producing large structures. This study presents a three-dimensional transient thermal model for WAAM process applied to Inconel 718 (IN718) alloy. The model simulates metal deposition using two different welding speeds to analyze their influence on thermal behavior and material characteristics. A moving heat source approach is adopted to replicate the dynamic conditions during deposition, incorporating temperature-dependent material properties and realistic boundary conditions. The simulation results provide detailed insights into temperature distributions, cooling rates, and thermal gradients, all of which are critical for understanding microstructural evolution and residual stress formation. These factors are important for understanding the part's microstructure, residual stress formation and overall quality. |
Proceedings Inclusion? |
Planned: Post-meeting proceedings |