| Abstract Scope |
Porous thin films are useful for a broad array of applications ranging from catalysis, separations, sorbents, and low-permittivity materials for electronics. However, the ability to create porous materials using atomic layer processing, such as atomic layer deposition (ALD) has not been clearly established. In this work, we examine the role of porogen introduction into ALD thin films, and the subsequent thermal processing of these films to create porous films with low density and low permittivity. These films may have use as low-k dielectrics in microelectronics and other areas. |