About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Printed Electronics and Additive Manufacturing of Advanced Functional Materials and Devices—From Processing Concepts to Applications
|
| Presentation Title |
Robust and Inexpensive process for DIW Printing of Conformable Electronic Circuits with Cleaner, Greener Solvents |
| Author(s) |
Elizabeth 'Athena' G. Fry, Maria Belandria Cirucci, Jeff S Barnhill, Darran Cairns |
| On-Site Speaker (Planned) |
Elizabeth 'Athena' G. Fry |
| Abstract Scope |
Using a direct ink writing (DIW) printer for extrusion, we proved a scalable process technique for fabricating highly durable, flexible embedded electronics (in this case, strain gauges). We developed cleaner, cheap ink and substrate using a soft thermoplastic polyurethane (TPU) and carbon black. We then optimized the printing and processing parameters to produce robust, stretchable pads that maintain structural integrity under extreme mechanical and environmental stress. The process yields a well-bonded, puncture-resistant substrate (resistant to finger pressure yet penetrable by fine wires) capable of withstanding extreme elongation, freezing temperatures and direct flame exposure. Cyclic testing demonstrated at least >20,000 strain cycles without performance degradation. This work highlights the potential of DIW process technology for scalable, low-cost manufacturing of resilient, integrated flexible electronics. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Surface Modification and Coatings, Additive Manufacturing, Process Technology |