About this Abstract |
Meeting |
2nd World Congress on High Entropy Alloys (HEA 2021)
|
Symposium
|
2nd World Congress on High Entropy Alloys (HEA 2021)
|
Presentation Title |
ON DEMAND: Solidification Behavior and Mechanical Properties of a MnFeCoNiCu HEA for Filler Applications |
Author(s) |
Benjamin Schneiderman, Andrew Chuang, Peter Kenesei, Olivia DeNonno, Jonah Klemm-Toole, Zhenzhen Yu |
On-Site Speaker (Planned) |
Benjamin Schneiderman |
Abstract Scope |
The characteristic properties of HEAs, including their tendency to favor single-phase solid solutions, the potential for sluggish diffusion, and the vast composition space available for exploration, make these alloys attractive candidates for filler materials in similar and dissimilar material joining applications. A non-equiatomic MnFeCoNiCu HEA was developed for joining and repair of Ni-base superalloy 600. An in-situ synchrotron-based study of the HEA solidification behavior indicated that classical concepts governing solidification were at play for this HEA. In this analysis, a novel, comprehensive approach to analyzing diffraction data—combining a hard-sphere approximation, thermodynamic simulations, thermal expansion measurement and microstructural characterization—was developed to circumvent the challenges posed by performing a conventional Rietveld refinement on a concentrated solid solution structure. Tension testing on brazed joints indicated that the HEA filler offers comparable strength and superior ductility relative to a conventional boron-suppressed filler at both room temperature and elevated temperature. |
Proceedings Inclusion? |
Undecided |