About this Abstract |
Meeting |
2022 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2022)
|
Symposium
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2022 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2022)
|
Presentation Title |
Copper Tape Manipulation for Additive Manufacturing |
Author(s) |
Nahid Tushar, Rencheng Wu, Muhammad Ghufran, Wenchao Zhou, Wan Shou |
On-Site Speaker (Planned) |
Nahid Tushar |
Abstract Scope |
Additive manufacturing (AM) has made significant strides in the past decades in printing different forms of materials ranging from the nanoscale to the macroscale. However, little research is available regarding the 3D printing of tape materials with unique geometry between filaments and sheets, such as copper tapes. Being able to print copper tape will greatly expand 3D printing capabilities for electronics, such as circuits, sensors, and actuators. In this work, we present a printhead design for 3D printing of tape materials, specifically, the copper tape is used as a proof of concept. Further, we demonstrate the printing of a LED circuit and a pressure sensor array. Such an end-effector can be easily integrated with existing printers or industrial robots. We believe this printing approach could unlock the potential of tape materials in AM, which can be extended to other materials, such as polyimide tape and carbon fiber prepreg tape. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |