About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advances in Metal Matrix Composites: Processing, Additive Manufacturing, and Applications
|
| Presentation Title |
Metal Matrix Composite Baseplate Materials for High Heat Dissipation and Durability in Next-Generation High-Performance Semiconductors |
| Author(s) |
Minsu Kim, Eunseo Cho, Jiyoon Lee, Jeonghwan Kim, Sangbok Lee, Sangkwan Lee, Hansang Kwon, Seungchan Cho |
| On-Site Speaker (Planned) |
Minsu Kim |
| Abstract Scope |
As semiconductor devices advance toward higher performance and integration, rising power consumption is accompanied by substantial heat generation. The resulting temperature increase causes functional problems—reduced device lifetime, higher failure rates, and degraded performance—as well as physical failures such as substrate warpage, wire bonding detachment, and solder interface delamination. Developing effective heat dissipation solutions has therefore long been a critical challenge.
Metal matrix composites (MMCs), combining a metallic matrix with ceramic reinforcement, offer excellent dimensional stability together with tunable thermal properties, attracting attention for semiconductor packaging, aerospace, and machine tool applications. In this study, a cubic boron nitride (cBN)-reinforced MMC base plate was developed to provide high thermal conductivity while minimizing thermal-shock-induced deformation.
The composites were fabricated by liquid pressure infiltration (LPI). Microstructure, thermal conductivity, coefficient of thermal expansion (CTE), and flexural strength were characterized, revealing uniform reinforcement distribution, favorable thermal conductivity, low CTE, and adequate flexural strength. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Composites, Ceramics, Aluminum |