| Abstract Scope |
The microstructure and intrinsic deformation mechanisms of metallic materials often promote intense plastic localization in polycrystals, which directly reduces fatigue performance. Through statistical characterization of plastic strain localization across a wide range of polycrystalline FCC alloys, we identified a subset of compositions that exhibit notably reduced slip localization under specific temperature conditions. Transmission electron microscopy analysis reveals a dynamic competition between dislocation slip, stacking faults, and nanotwinning, resulting in a pronounced homogenization of plastic deformation throughout the microstructure. This delocalization mechanism significantly enhances fatigue resistance, opening a new design space for fatigue-resistant alloys. In this work, we further examine the role of competing deformation processes, including slip, twinning, and grain boundary sliding, on the fatigue behavior of FCC materials. |