About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Thermal Transport and Reliability of Indium–Diamond Composite Paste for Advanced Packaging Applications |
| Author(s) |
Yuan-Han Ku, C. Robert Kao |
| On-Site Speaker (Planned) |
Yuan-Han Ku |
| Abstract Scope |
Indium-based soft-metal thermal interface materials (TIMs) are attractive for advanced electronic packaging owing to their low melting point, high compliance, and excellent interfacial contact. However, their thermal performance remains limited by the intrinsic thermal conductivity of indium, particularly under the increasing heat dissipation demands of artificial intelligence and 5G applications. In this study, an indium/diamond particles composite paste will be developed and bonded to metallized substrates for TIM applications. Diamond particles will be incorporated as high thermal conductivity fillers to enhance heat transport within the indium matrix. The effects of diamond reinforcement and surface condition on effective thermal conductivity, interfacial thermal resistance, bonding strength, and reliability will be systematically investigated. This study is expected to demonstrate the feasibility of indium/diamond composite paste for metallized substrate bonding and provide their potential for high-performance TIM design. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Other, Other, Other |