About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Damage accumulation and failure in Sn-3Ag-0.5Cu/Cu and Sn-0.5Cu-0.04Ni/Cu solder joints |
| Author(s) |
Kazuhiro Nogita, Jiye Zhou, Xin Fu Tan, Stuart McDonald, Keith Sweatman, Tetsuro Nishimura, Kazuhiro Yasuda |
| On-Site Speaker (Planned) |
Kazuhiro Nogita |
| Abstract Scope |
To improve the reliability of electronic devices it is essential to understand the mechanisms of solder failure and how it relates to damage accumulation and microstructural changes in the solder joint. However, it is difficult to understand these mechanisms with post-mortem analysis of failed solder joints. In this research, we used advanced microscope techniques with real-time imaging to visualise the microstructure of solder joints during the application of a load. This allowed the observation of a range of dynamic events including the formation of dislocations, recrystallisation, grain boundary separation and eventual failure in Sn-3wt.%Ag-0.5wt.%Cu (SAC305) and Sn-0.5wt.%Cu-0.04wt.%Ni (SN100C) alloys soldered on copper substrates. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Electronic Materials, Joining |