About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
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| Presentation Title |
Solid-State Interfacial Reactions and Intermetallic Compound Growth Kinetics in Sn-Ag Solder/Fe-Ni Under-Bump Metallization Systems |
| Author(s) |
Zhou-Yi Wu, Fang-Ju Hsu, Ai-Wen Chai, Fan-Yi Ouyang |
| On-Site Speaker (Planned) |
Zhou-Yi Wu |
| Abstract Scope |
As semiconductor packaging advances toward fine-pitch interconnects, suppressing interfacial reactions during solid-state aging is essential for improving solder joint reliability. Conventional Ni under-bump metallization (UBM) suffers from continuous intermetallic compound (IMC) growth and UBM consumption during long-term thermal exposure. This study investigates the IMC growth kinetics of Ni/SnAg and Ni/FeNi/SnAg interconnects during isothermal aging at 125, 150, and 175 °C for different periods. The FeNi UBM significantly suppresses IMC growth and UBM consumption compared with Ni. Kinetic analysis shows that IMC growth follows a parabolic law, indicating diffusion-controlled growth. Arrhenius analysis further reveals that the FeNi UBM exhibits a higher activation energy for IMC growth than Ni, demonstrating that FeNi effectively reduces interfacial diffusion and retards reaction kinetics. The improved diffusion-barrier performance enhances interfacial stability during prolonged thermal exposure. These findings establish FeNi alloys as promising UBM materials for improving the reliability of fine-pitch solder interconnects in advanced semiconductor packaging. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
電子材料, 薄膜與界面, 相變 |