About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Reliability Enhancement of Bi and In Additions for Advanced Packaging |
| Author(s) |
Wei-Ting Lin, Kelvin Li, Kuo-Shu Lin, Chang-Meng Wang, Albert T. Wu |
| On-Site Speaker (Planned) |
Wei-Ting Lin |
| Abstract Scope |
The increasingly harsh operating environments of high-reliability electronic products have highlighted the limitations of SAC305 solder. In this study, bismuth (Bi) and indium (In) were added to the Sn-Ag-Cu system to develop a high-reliability solder alloy, Sn-Ag-Cu-Bi-In. The alloy had a melting point of 209 °C. The lower reflow temperature reduced thermal damage to solder joints. Solder paste and solder balls were applied to CTBGA228 test boards and subjected to reliability tests. The new alloy demonstrated better mechanical reliability compared to SAC305. Hot storage testing was performed on CAPGA192 boards. Microstructural changes, IMC thickness, and IMC morphology were analyzed. The IMC growth rate in the Bi- and In-added alloy was slower than that of SAC305. These results indicate that the addition of Bi and In significantly enhances the reliability of the solder alloy compared to SAC305. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Other, Other |