About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Hybrid-Grain Electroplated Cu Films for Enhanced Cu–Cu Bonding |
| Author(s) |
Hsiang-Yu Wei |
| On-Site Speaker (Planned) |
Hsiang-Yu Wei |
| Abstract Scope |
Direct Cu-Cu bonding is a key enabler for high-density interconnects with pitches below 10 μm. However, to mitigate the potential damage associated with conventional thermocompression bonding (TCB), it is essential to reduce the bonding temperature and overall thermal budget. To overcome this challenge, we propose a novel Cu composite structure fabricated via a two-step electroplating process, in which submicron grains and micron grains are sequentially deposited to form a hybrid microstructure. This engineered structure leverages the rapid diffusion characteristics of submicron grain while concurrently benefiting from the thermal and structural stability provided by micron grains. The integration of these two grain size regimes enables a synergistic enhancement in Cu–Cu bonding performance, with shear strength reaching up to 35 MPa. Furthermore, the submicron grain regions exhibit low impurity incorporation, contributing to the overall integrity and reliability of the bonded interface. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Copper / Nickel / Cobalt, Electronic Materials, Joining |