About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Pressure-induced whisker growth from Sn coatings. |
| Author(s) |
Piyush Jagtap |
| On-Site Speaker (Planned) |
Piyush Jagtap |
| Abstract Scope |
Whisker growth from Sn coatings has been studied extensively in recent years. Although compressive stress in Sn coatings is known to drive the whisker growth, the specifics of the grain characteristics that enable whisker formation are not well understood. Recently, we developed a pressure-induced whisker growth technique in which the whisker growth can be controlled by the application of external pressure on the coatings. Our results indicate that a few whiskers continued to grow as long as pressure on the samples was maintained, while the growth of most whiskers stopped suddenly after a period of linear growth. In this work, we present the FIB, EBSD, and TEM analysis to understand the microstructural characteristics of the underlying whisker grain to answer why only few whiskers continue to grow while most of them stop even though the pressure is maintained on the samples. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Characterization, Thin Films and Interfaces |