About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Microstructure Evolution and mechanical Response of Bi/Ni-Modified SAC105 Solder |
| Author(s) |
Xiaojuan Hu, Lingxue Guo, Meiyu Xu, Di Lin, Zeng Guang, Tianhong Gu |
| On-Site Speaker (Planned) |
Xiaojuan Hu |
| Abstract Scope |
Low-Ag Sn-1.0Ag-0.5Cu (SAC105) is considered one of the most promising solder alloys due to its higher ductility and better drop shock resistance. In this study, to address the challenges caused by the reduced Ag content and meet the demands of applications in extreme service environments, Bi and Ni elements were introduced to optimize the microstructure and improve overall reliability. Furthermore, directionally solidification technique was applied to further control the microstructure and phase distribution. The solidification behavior and microstructure evolution of SAC105-3Bi-0.05Ni (wt. %) additions were investigated using thermodynamic calculations and analytical scanning electron microscopy. The effects of microstructural changes on the mechanical response, deformation characteristics and failure mechanisms were analyzed by tensile creep, in-situ tensile testing, thermal cycling and micropillar compression. The findings aim to clarify the relationship between alloying design, microstructure control, and mechanical reliability, providing insights for the development of high-performance lead-free solders for advanced electronic packaging. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Characterization, Mechanical Properties |