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Meeting 2027 TMS Annual Meeting & Exhibition
Symposium Microstructure-Sensitive Design and Advanced Characterization: An MPMD/SMD Symposium Honoring David T. Fullwood
Presentation Title A Recapitulation of 3D Microstructures
Author(s) Anthony D. Rollett
On-Site Speaker (Planned) Anthony D. Rollett
Abstract Scope David Fullwood’s many contributions to the study of materials microstructures are honored through a recapitulation of 3D studies. Early on this involved such challenges as the registration of serial sections to assemble plausible 3D microstructures, instantiation of simulations, evaluation of statistical quality, and comparison against classical models of grain growth. Synchrotron x-ray microscopy proved to be a useful complement to serial sectioning, particularly where microstructural evolution was important. Microstructures in 3D have larger neighborhoods than in 2D which proved useful, e.g., in early 3D reconstructions of parent microstructures prior to phase transformation in titanium and steels. The shapes and topologies of individual grains in 3D have provided data for many attempts to predict evolution but the evidence increasingly points to the importance of interface networks, which is a species of 2-point correlation, again an important focus of his contributions to microstructural science.
Proceedings Inclusion? Planned:
Keywords Characterization,

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Beyond Characteristic Spacing: A Microstructure-Sensitive Statistical Framework for Precipitate Strengthening in Complex Alloys
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Deformation Mechanisms in Pristine Ruthenium Microparticles Produced via Solid-State Dewetting
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Disconnection-enabled Plastic Shear De-localization in Austenitic Stainless Steel
From Defects to Fracture: A Multiscale, Microstructure-Sensitive View of Ductile Rupture in Metals
Grain Boundary Effects on Nanoindentation response of Tantalum Bicrystals: Experiments and Coupled Crystal Plasticity-Cohesive Zone Element Modeling
Grain boundary segregation-controlled plasticity in magnesium rare-earth alloys
HR-EBSD analysis of thin films and microelectronic devices
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Integrated processing–microstructure–property modeling of LPBF pure copper and GRCop-42 for rotating detonation engine applications
Measurement of Flow Stresses for High Strain Rate, High Temperature Processes: Application to Friction Stir and Rotary Friction Welding
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Modelling Recrystallization Texture Evolution During Thermomechanical Processing of Secondary Aluminium Alloys: A High-Resolution CPFFT–CA Coupled Workflow
Multiscale Mechanical Characterization and Statistical Microstructure Quantification of Ti-based Bulk Metallic Glass-Matrix Composites
Optimizing the Microstructure and Texture for a Given 6xxx Series Al Alloys Under Tensile Loading Conditions Using Crystal Plasticity
Patterns First: A Retrieval-Augmented, Uncertainty-Aware Platform for High-Fidelity EBSD Acquisition to Enable Microstructure-Sensitive Design
Porosity-Dependent Fracture Prediction of Aluminum Die-Castings Using a Microstructure-Informed GTN Damage Model
Predicting Microstructure-Dependent Yield Behavior in Polycrystals Using a Stochastic Crystal Plasticity FEM Framework
Sensitivity assessment of full-field HR-EBSD to pattern acquisition parameters
Simulations of Grain boundary-dislocation interactions
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Stochastic Digital Process Twin Design of Mesoscale Surface-Machined Polycrystalline Metals
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Virtual Aperture Electron Backscatter Diffraction for Dislocation Mapping

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