Conference Logo ProgramMaster Logo
Conference Tools for 2027 TMS Annual Meeting & Exhibition
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools

About this Abstract

Meeting 2027 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
Presentation Title Structural and Phase Stability of Interpenetrating Ag Nano-Islands in Nafion Soft Actuators
Author(s) An-Jun Zheng, Takashi Harumoto, Ji Shi, Wan-Ting Chiu
On-Site Speaker (Planned) An-Jun Zheng
Abstract Scope Understanding the nanostructure formation kinetics and phase stability of electrically conductive metal thin film within soft polymers is critical for developing durable electroactive materials. In this work, interpenetrating Ag nano-islands (Ag NIs) were formed in Nafion via ion-exchange-assisted in-situ chemical reduction. Cross-sectional analysis revealed subsurface Ag penetration, creating a mechanically interlocked morphology that yielded a low sheet resistance of 0.59 Ω sq-1 with stable electrical conductivity under deformation. The resulting Ag NIs/Nafion composite exhibited excellent durability during tensile, peeling, and bending tests. Under an applied voltage of as low as 3 V, the actuator achieved a bending angle of 44.4° and a blocking force of 2.6 mN. Furthermore, the integrated nanostructure-Ag phase suppressed water loss, stabilizing the hydrated state under dynamic bias. These findings provide an effective strategy for controlling metal thin film formation and morphological evolution in soft electroactive polymer systems.
Proceedings Inclusion? Planned:
Keywords Characterization, Composites, Nanotechnology

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A strain-driven compositional detour in an in situ TCP precipitation
Autonomous assessment of phase formation using the AlloyBot self-driving laboratory
Bonding ability of direct Ag nanostructures formed by metal-organic decomposition
Concentrated Sliding Friction Strengthened Dissimilar Stainless Steel/Ti Interface via Phase Transformation During Ultrasonic Spot Welding
Design and development of the multi-functional Ni-Mn-Ga composites for energy conversion
Diffusion Investigation in Cu-Co System
Effect of Annealing on Microstructure in a Zr-Based Thin-Film Metallic Glass Diffusion Barrier and Interfacial Reactions during Cu/Sn/Cu Thermocompression Bonding
Effects of Bi Additions on the Characteristics of Sn-In Solder
Electrostatic Assembly of Silver Micro/Nano Hybrids for Low Temperature Die Attach Sintering below 200 °C
Enhanced Corrosion Resistance and Reliability of Coated Copper Wire Bonding in Automotive Electronics via Interface Engineering
Enhanced Energy Storage Performance via Machine Learning Defined Phase Formation-Property Relationships in Multi-component Alloys
How to design high-strength Sn-In solders using CALPHAD and machine learning approach
In-Situ Investigation of Tensile Behavior and Creep Response in Sn–Bi-Sb Low-Temperature Solders
Interlayer-driven interfacial phase transformations during ultrasonic welding of titanium
Investigation of Fe/Zn Interfacial Reaction Behavior and Corrosion Properties of Different Steels during Hot-Dip Galvanizing
Investigation of interfacial Reactions between Sn-xZn Solder and Cu-4.3 at.%Ti Alloy(C1990HP)
Investigation of Liquid/Solid Interfacial Reactions in the Sn-9Zn/Fe-xNi Couples
Machine Learning-Based Analysis of Residual Stress States in Nanocrystalline Thin Films
Mechanism of Diffusion Barriers Impacting the Failure Mechanism of Sn-Based Solder Joints
Mechanisms of Indium Addition in Modulating Interfacial Reactions and Enhancing the Mechanical Properties of Solder Joints
Microstructure-Dependent Crack Evolution and Creep Response of Sb-added Sn–Bi Low-Temperature Solders
Microstructure-Dependent Current Transport and Joule Heating in Ag Nanowire Networks under Electric Field
Microstructure Evolution of Cu Interconnects under Electromigration: Implications for Hybrid Bonding in Advanced 3D Chip Integration
Nanostructural Characterization for the Interface of Cu Metallized Glass Substrate Prepared via the TORIZING Process
Phase diagrams and interfacial reactions of Co-Ni-Ge ternary system
Phase equilibria of Ni-Ge-Sb and Cu-Ni-Ge ternary systems
Solid-State Interfacial Reactions and Intermetallic Compound Growth Kinetics in Sn-Ag Solder/Fe-Ni Under-Bump Metallization Systems
Structural and Phase Stability of Interpenetrating Ag Nano-Islands in Nafion Soft Actuators
The Influence of Undercooling on β-Sn Nucleation and Crystallographic Selection in Near-Eutectic Sn–58Bi Solder
Thermal Shock Reliability Evaluation of Ag-Al Paste Joints in SiC Power Modules

Questions about ProgramMaster? Contact programming@programmaster.org | TMS Privacy Policy | Accessibility Statement