About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Deformation Mechanisms, Microstructure Evolution, and Mechanical Properties of Nanoscale Materials
|
| Presentation Title |
High Peak Hardness in Al-Ni Multilayer Thin Films Originate from Intermetallic Interface Contributions |
| Author(s) |
Nicolas J. Peter, Marilaine Moreira de Lima, Xi Li, Ruth Schwaiger |
| On-Site Speaker (Planned) |
Nicolas J. Peter |
| Abstract Scope |
Nanometallic multilayer systems provide a suitable tool to study the effect of interfaces subjected to thermodynamic or mechanical stimuli. Most studies fabricated layered systems of elements with a positive enthalpy of mixing to create almost atomically sharp interfaces, e.g. Cu-Ag. By contrast, few studies investigated the interface morphology for systems with negative enthalpy of mixing in depth. We investigate here the reactive Ni-Al system on sputter deposited samples with a varying layer thickness between 5 and 250 nm. It was found by aberration-corrected electron microscopy and electron energy loss spectroscopy that a relatively large negative enthalpy of mixing leads to intermetallic-like bonding at the interface for small layer thicknesses and B2-NiAl “pockets” at the interface of large layer thicknesses. Consequently, we measure a peak hardness of 9.03 ± 0.14 GPa, which is the highest measured so far for fcc-fcc layered systems and shows the potential of this interface engineering route. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Mechanical Properties, Thin Films and Interfaces |