About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Electromigration Behavior of TLP Bonded Ni/Sn-1.0Ag-0.5Cu/Ni Solder Interconnects: An EBSD Study |
| Author(s) |
Shih-Yu Huang, Yan-Cheng Guo, Hsin-Yu Peng, Chien-Lung Liang |
| On-Site Speaker (Planned) |
Shih-Yu Huang |
| Abstract Scope |
Transient liquid phase (TLP) bonding offers the advantages of low-temperature processing and high thermal stability of solder interconnects. In this study, line-type Ni/Sn-1.0Ag-0.5Cu/Ni solder interconnects were fabricated using TLP bonding at 260°C to achieve full intermetallic compound (IMC) joints. The interfacial reaction and growth kinetics of the predominant Ni3Sn4 IMC during liquid/solid TLP bonding were investigated. The phase stability of the interconnect under long-term current stressing at 5.0 × 103 A/cm2 for up to 200 h was examined. The electromigration-induced grain growth, morphological and crystallographic evolutions, and void formation were further characterized using scanning electron microscope (SEM) and electron backscatter diffraction (EBSD). This study provides insights into both thermally and electrically induced microstructural evolutions, contributing to a deeper understanding of solder interconnect stability for advanced packaging applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Characterization, Other |