About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
|
| Presentation Title |
Nanostructural Characterization for the Interface of Cu Metallized Glass Substrate Prepared via the TORIZING Process |
| Author(s) |
Masahiko Nishijima, Sangmin Lee, Ming-Chun Hsieh, Takuya Nakagiri, Rieko Okumura, Yuhei Kitahara, Junji Yoshikawa, Chuantong Chen, kimihiro yamanaka, Katsuaki Suganuma |
| On-Site Speaker (Planned) |
Masahiko Nishijima |
| Abstract Scope |
Traditionally, resin-based core substrates have been used in semiconductor packages. However, as substrate sizes have increased and the integration of multiple dies and chips has advanced, issues such as substrate shrinkage and warpage, increased power consumption, and significant heat generation have become apparent. Currently, glass-core substrates and their copper plating are being actively developed as alternatives to conventional resin substrates. A new copper plating process, the “TORIZING Process” (Okuno Chemical Industries, Ltd.), achieves high adhesion and exhibits excellent film formation even on the inner walls of through-holes, thereby enabling performance equivalent to that of conventional methods.
To understand the adhesion mechanism as well as improve these characteristics, it is necessary to elucidate the fundamental mechanisms involved.
In this study, we investigated the bonding interface of TORIZING-treated copper-plated glass substrates using scanning transmission electron microscopy (STEM), X-ray photoelectron spectroscopy (XPS), and time-of-flight secondary ion mass spectrometry (ToF-SIMS) and report our findings. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Thin Films and Interfaces, Electronic Materials |