About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advances in Materials Deposition by Cold Spray and Related Technologies IV
|
| Presentation Title |
Cold Spray-Enabled Functional Coatings for Advanced Electronic Packaging and Integrated Passive Components |
| Author(s) |
Denny John, Anil Lama, Azmal Choudhary, Ambreen Nisar, Pulugurtha Markondeya Raj, Tyler Dolmetsch, Tanaji Paul, Arvind Agarwal |
| On-Site Speaker (Planned) |
Denny John |
| Abstract Scope |
Cold spray (CS), due to its ability to kinetically consolidate materials in solid-state, offers potential for fabricating functional capacitors and dielectrics for electronic packaging applications. In this work, porous aluminum and BaTiO₃ coatings were deposited using low-pressure CS to demonstrate the direct fabrication of functional electronic materials through a solid-state process. Porous Al coatings deposited directly onto metallic leadframes exhibited controlled open porosity and surface-area enhancement of ~22× relative to planar geometries, enabling capacitance densities up to 49 nF/mm². In parallel, nanostructured BaTiO₃ coatings (~10 µm thick) were successfully deposited through impact-induced deformation, resulting in microstructural refinement and partial tetragonal-to-cubic phase transformation (~33%). The evolved microstructures retained functional dielectric behavior, exhibiting relative permittivity values of ~300–700, low leakage current, and stable frequency response. These findings demonstrate how particle impact dynamics, porosity evolution, and crystal-structure modifications can be leveraged to engineer electronic functionality in cold-sprayed materials for next-generation electronic packaging. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Other, Other, Other |