About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Microstructural Evolution and Interfacial Reaction between Indium Solders and Ag under a Temperature Gradient during Reflow Process |
| Author(s) |
Ting-Yu Chou, Zhou-Yi Wu, Po-Hsun Yang, Fan-Yi Ouyang |
| On-Site Speaker (Planned) |
Ting-Yu Chou |
| Abstract Scope |
With the advancement of 3D IC packaging, low-melting-point solders are increasingly sought after for improved thermal and mechanical reliability. This study investigates intermetallic compound (IMC) formation in Ag/In/Ag sandwich structures subjected to either conventional reflow or thermal gradient bonding (TGB) on a 180 °C hot plate. Under reflow, minor temperature gradients result in symmetric IMC growth at both In/Ag interfaces. In contrast, TGB with a 40 °C/cm gradient induces asymmetric growth, with accelerated IMC formation at the cold end due to the migration of Ag atoms from hot to cold regions. The molar heat of transport (Q*) of Ag in molten In is determined to be 22.98 kJ/mol. Both AgIn₂ and Ag₉In₄ IMCs are observed under both bonding conditions. These results underscore the significant influence of thermal gradients on IMC growth behavior, emphasizing the importance of precise thermal management to ensure interconnect reliability in advanced packaging applications. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Other, Other, Other |