About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Effect of Ag Addition on the Microstructural Evolution and Bonding Behavior of Cu–Ag Alloy Thin Films |
| Author(s) |
Sung-Jui Hsu, Yu-Chieh Wang, Fan-Yi Ouyang |
| On-Site Speaker (Planned) |
Sung-Jui Hsu |
| Abstract Scope |
Ag addition is an effective approach for improving the mechanical properties of Cu thin films for advanced interconnect applications. However, the influence of Ag on the microstructural evolution and bonding behavior of Cu thin films during thermal processing remains insufficiently understood. In this study, Cu–Ag alloy thin films prepared by co-sputtering were subjected to low-temperature annealing and thermocompression bonding at 200 °C. Annealing under identical thermal conditions was performed to distinguish thermal-induced microstructural evolution from interfacial bonding effects. The results show that Ag precipitation and grain-boundary segregation occur during thermal exposure. While the bonded area was primarily governed by the initial surface roughness, Ag segregation at the bonding interface together with annealing-induced tensile residual stress reduced the joint strength. These results reveal how Ag addition influences thermal stability and bonding behavior, providing insights into the design of Cu-based alloy thin films for low-temperature direct bonding. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Electronic Materials, Joining, Thin Films and Interfaces |