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Meeting 2026 TMS Annual Meeting & Exhibition
Symposium Printed Electronics and Additive Manufacturing of Advanced Functional Materials and Devices—From Processing Concepts to Applications
Presentation Title Radically-Accessible Approach to 3D Printing of Aluminum Alloys for Structural and Electronic Applications
Author(s) Keng Hsu, Nathan Fonseca
On-Site Speaker (Planned) Keng Hsu
Abstract Scope Metal additive manufacturing is disrupting the design, production, and supply chain of high-performance components in industries such as aerospace, medicine, and electronics packaging. Unfortunately, accessibility of MAM has eluded small and medium sized American manufacturers: high equipment and running costs & energy consumption, and need for costly auxiliary and post processes have prevented viable business cases to be developed. The Resonance Assisted Deposition (RAD) technique uses small oscillations and voxel compression to print 3D metal parts in solid-state. 3-dimensional objects formed this way have greater than 99.98% density as-built, and requires no post-fabrication processing. This technique is carried out in ambient conditions that requires no gas or particle control. As compared with state-of-the-art melt-fusion AM technologies, the RAD technique as a Metal AM technology provides significant savings in equipment & facility capital, presents no safety and health risks, and has a workflow as simple as that of the FFF technology.
Proceedings Inclusion? Planned:
Keywords Additive Manufacturing, Aluminum, Sustainability

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Additively Printed Biomass-Based Triboelectric Sensors for Self-Powered Skin-Integrated Electronics
Aerosol Jet Printed Electronic Devices and Components at Sandia National Laboratories
Analysis of Coaxial Direct Ink Writing for Embedded Sensors in Soft Robotic Applications
Bilayer Molybdenum Disulfide Strain Controlled Field Effect Transistor
Binder Jet Printing and Consolidation of Soft Magnetic Ferrites
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Conductive inks sintering challenges, performances, and perspectives, for the pad printing of electronic circuit and sensors
Controllable Assembly of Nanomaterials in 3D via Printing
Development of L-DED Technology for Depositing Dissimilar Materials in Sub-Millimeter Narrow Grooves
Dry Multimaterial Printing Directly from Raw Materials
Electrically Conductive 2D MXene Carbides for Printed Electronics and Additive Manufacturing
Enhancing Capacity of Cobalt-Free Lithium-Ion Batteries via Aerosol Jet Deposited Ultra Thick Micro Architected Electrode Structures
Epitaxial nanodiamond and Q-carbon nanoballs designed structures formed by direct-laser-writing for quantum sensing
Exploring Bayesian and Taguchi optimization pathways for aerosol jet printing
Flexible Amorphous Homojunction Transistors Printed from Eutectic Liquid Metal Alloys
Functional Thin Film Material Enabled Optical Sensor Technologies in Energy and Defense Applications
High-Resolution Liquid Metal-Based Stretchable Electronics Enabled By Colloidal Self-Assembly and Micro-Transfer Printing
High-temperature annealing of direct-laser-written 3D structures for phase transformation into nanodiamond and Q-carbon
High-temperature superconductivity in direct-laser-written patterned B-doped Q-carbon structures
Hybrid 3D Printing of Liquid Metal-Polymer Architectures for Advanced Soft Electronics
Hybrid Integration of Laser-Induced Graphene and Direct-Ink-Written Silver for Flexible Electrochemical Sensors
Improved Sensitivity in Triboelectric Pressure Sensors through Aerosol Jet Printed Texturing
Ink Formulation and Process Development to Tailor Aerosol Jet Printing
Large Area Micropatterning of CdSe Nanoplatelets
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Optimizing Printing of PEDOT:PSS for Flexible Electronics by Aerosol Jet Printing
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Printable Copper Materials for Flexible Hybrid Electronics
Printing Energy Storage: Direct Ink Writing of MXene Architectures for 3D Batteries and Supercapacitors
Process–Structure–Function relationships in laser-induced graphene for electrochemical sensing Applications
Radically-Accessible Approach to 3D Printing of Aluminum Alloys for Structural and Electronic Applications
Robust and Inexpensive process for DIW Printing of Conformable Electronic Circuits with Cleaner, Greener Solvents
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Scalable Fabrication of 2D 1T-TiS₂ Nanosheets for High-Performance Energy Storage Applications
Scalable Fabrication of LIGMIS: Laser-Induced Graphene Microfluidic Integrated Sensors for Point-of-Need Monitoring
Side-Selective Patterning of Laser-Induced Graphene for Flexible and Implantable Devices
Surface Force-Driven Direct Ink Writing: Unconventional Deposition of Textured Thin Films
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Ultrasound Assisted Multi-Material 3D Printing of Flexible, Multilayered Electronic Circuit

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