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Meeting 2026 TMS Annual Meeting & Exhibition
Symposium Thermodynamics and Kinetics of Alloys IV
Presentation Title Thermodynamic-Guided Understanding of Microstructure and Properties in Low-Melting Alloys for Semiconductor Packaging
Author(s) Yu-An Shen, Chih-Hsiang Liu, Tzu-Hsiang Liao
On-Site Speaker (Planned) Yu-An Shen
Abstract Scope The advancement of semiconductor packaging has increased focus on low-melting alloys (LTAs), which are essential for electrical, thermal, and mechanical interconnections between chips and carriers. Their thermal properties, mechanical properties, and soldering performance significantly affect the joint reliability and soldering conditions. Understanding the mechanisms behind microstructure formation and property evolution is crucial for the development of next-generation LTAs. This study presents a thermodynamic-guided investigation of several LTA systems, including Sn–9Zn–x, Sn-Bi-based alloys with minor additions, and Sn-rich LTAs soldered to high-entropy alloys. Thermodynamic calculations are employed to interpret phase formation, melting behaviors, and soldering reactions. The integration of computational predictions with experimental observations provides critical insights into microstructure–property relationships and guides alloy optimization. These findings highlight the value of thermodynamic tools in advancing the design of reliable LTAs for semiconductor packaging applications.
Proceedings Inclusion? Planned:
Keywords Electronic Materials, Joining, Phase Transformations

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