About this Abstract |
Meeting |
2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
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Symposium
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2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
|
Presentation Title |
A Cooling Device for Drastically Reducing Manufacturing Time in Wire-DED |
Author(s) |
M. Ali Yikilmaz, Albert C. To |
On-Site Speaker (Planned) |
M. Ali Yikilmaz |
Abstract Scope |
While wire-based directed energy deposition (DED) is effective for large components due to its high deposition rate, overall build time is limited by long cooling periods, e.g., each layer takes about 3 minutes to print, but cooling can exceed 30 minutes in the case of Inconel 625. Accelerated cooling below 300 °C is considered safe and accounts for nearly 80% of the total cooling time. This study presents a novel cooling device that extracts heat from the top layer in a controlled manner, mimicking substrate cooling. The system includes a heat exchanger and a flexible interface that conforms to the rough printed surface. A membrane and thermal paste increase thermal contact and improve heat transfer. Initial results show a 40% reduction in cooling time below 300 °C, reducing total build time by up to 30%, thus saving nearly a week on builds that would need three weeks without the cooling device. |
Proceedings Inclusion? |
Planned: Post-meeting proceedings |