About this Abstract |
| Meeting |
2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
|
| Symposium
|
2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
|
| Presentation Title |
Feasibility Study on a 2-Step Curing Process to Manufacture Dielectric and Electrically Conductive Materials |
| Author(s) |
Seungjun Lee, Gavin Stafford, Natalya Kublik Crawford, Timothy Yap, Kyubin Bae, Zhichao Li, Zachariah Page, Michael Cullinan, Chih-Hao Chang |
| On-Site Speaker (Planned) |
Seungjun Lee |
| Abstract Scope |
The co-printing of dissimilar materials has opened doors to the printing of integrated circuits, metamaterials, soft actuators, flexible sensors, among others. However, most systems in vat-photopolymerization-based additive manufacturing are limited to resin exchange or injection, with few works in orthogonal light source photoreactions and grayscale imaging. Additionally, few studies have presented capabilities to co-print electrically conductive and dielectric materials. This work consists of a feasibility study of a 2-step process to co-print electrically conductive and dielectric materials using a single resin as feedstock. A silver-monomer hybrid resin is designed and prepared to allow for polymerization or silver curing contingent to the varying of UV exposure alone. Both resin composition and dosage levels are investigated and optimized. Resulting parts are characterized by optical and electron microscopies, profilometry, and conductivity tests through 4-point probe. |
| Proceedings Inclusion? |
Planned: Post-meeting proceedings |