About this Abstract |
| Meeting |
MS&T26: Materials Science & Technology
|
| Symposium
|
Joining/Bonding of Dissimilar Materials
|
| Presentation Title |
Interface Characterization of a Silicon-LTCC Compound Material |
| Author(s) |
Clemens Motzkus, Beate Capraro, Martin Seyring, Richard Engemann, Leonid Shupletsov |
| On-Site Speaker (Planned) |
Clemens Motzkus |
| Abstract Scope |
A composite material from silicon and LTCC (Low temperature cofired ceramics) is formed by a sintering step. Both materials can be processed by their standard processing sequences: Thin film for silicon and stanard LTCC-processing for the ceramic. As a result a material compound witha unique combination of properties and the potential for producing highly integrated micro systems is formed. The SiCer-process can act as an alternative to anodic bonding without the need for alkali metals or direct wafer bonding without additional polishing. The presentation focuses on the interface between silicon and the LTCC. Titanium and titanium dioxide layers on top of silicon were investigated on their influence on the bonding behavior of the LTCC to silicon. The microstructure of the interface was investigated. Changes of the morphology of the wetting layer and enrichment of some LTCC components around the wetting layer were observed. |