About this Abstract |
Meeting |
2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
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Symposium
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2025 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2025)
|
Presentation Title |
Aerosol Jet Printing of Interconnects and Polymer Ramps for Heterogenous Integration |
Author(s) |
Jacob Manzi, Max Tafoya, Mieko Hirabayashi, Judith Lavin |
On-Site Speaker (Planned) |
Jacob Manzi |
Abstract Scope |
Advanced microelectronic packaging increasingly involves stacked chips or mounting die on substrates to achieve high integration density. Limitations with current methods include large vertical footprints (wire bonding), and printing on non-planar substrates with limited slope control (inkjet printing). This study utilizes aerosol jet printing (AJP), a direct-write method of additive manufacturing, for the layered deposition of UV-curable polymers to create sloped ramps. This approach provides precise, selective control over the geometry and feature size of the deposition of both polymer and silver materials. This control over deposition is leveraged for constructing 3D electrical interconnects with enhanced structural integrity and optimal electrical performance. Utilizing the same fabrication process for both materials simplifies alignment and facilitates effective integration in advanced microelectronic systems. SNL is managed and operated by NTESS under DOE NNSA contract DE-NA0003525. |
Proceedings Inclusion? |
Planned: Post-meeting proceedings |