About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Interfacial Reaction in Cu-37Zn/Sn/Cu-37Zn Solder Interconnects Induced by Electromigration: An EBSD Study |
| Author(s) |
Hsin-Yu Peng, Yu-Chun Liu, Shih-Yu Huang, Chien-Lung Liang |
| On-Site Speaker (Planned) |
Hsin-Yu Peng |
| Abstract Scope |
Interfacial reaction and intermetallic compound (IMC) formation in Cu-37Zn/Sn/Cu-37Zn line-type solder interconnects induced by solid-state electromigration were investigated. This study highlights the alloying effects of pure Cu substrate on interfacial IMC modification and potential inhibition of detrimental Kirkendall effect. The solder interconnects were stressed at different current densities (8.0-8.6 × 103 A/cm2) for different durations (0-72 h) under ambient conditions. The incorporation of Zn-alloyed Cu substrate suppressed the undesirable Cu3Sn formation and accompanied Kirkendall voids. A dual-phased Zn-rich IMC + Cu6Sn5 layer was formed during current stressing, serving as a diffusion barrier against further Cu6Sn5 growth. The IMC growth kinetics further revealed primary diffusion mechanism and polarity effect under electromigration. This study provides advanced metallurgical information, such as grain size, crystallographic orientation, grain boundary characteristics, and intra-grain misorientation angles in solder interconnects, characterized by electron backscatter diffraction for the potential application of Cu-Zn alloy substrate in electronic packaging |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Thin Films and Interfaces, Other |