| About this Abstract |
| Meeting |
Materials Science & Technology 2019
|
| Symposium
|
Joining of Advanced and Specialty Materials XXI
|
| Presentation Title |
Investigation of Mechanical Properties of Sn-5Sb and Sn-6.4Sb-3.9Ag High-temperature Lead-free Solder |
| Author(s) |
Kohei Mitsui, Ikuo Shohji |
| On-Site Speaker (Planned) |
Kohei Mitsui |
| Abstract Scope |
In this study, tensile and low fatigue properties of Sn-5Sb (mass%) and Sn-6.4Sb-3.9Ag (mass%) high-temperature lead-free solder were investigated at 25℃ and 175℃ with miniature size specimens. 0.1% proof stress and tensile strength of Sn-6.4Sb-3.9Ag are superior to those of Sn-5Sb, and elongation of Sn-6.4Sb-3.9Ag is inferior to that of Sn-5Sb at both temperatures. The fatigue life of Sn-6.4Sb-3.9Ag obeys the Manson-Coffin equation and the effect of the temperature on the fatigue life is negligible. Sn-6.4Sb-3.9Ag has superior fatigue properties compared to Sn-5Sb at 175℃. From the results of electron backscatter diffraction pattern (EBSD) analysis, it was found that the crack grows linearly at high angle grain boundaries in Sn-5Sb at 175℃. In Sn-6.4Sb-3.9Ag, the recrystallization by the dynamic recovery occurs in the larger area at 175℃ and the crack grows at complicated grain boundaries. |