About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
2D Materials – Preparation, Properties, Modeling & Applications
|
| Presentation Title |
Enhancement of electrical conductivity in copper-graphene multilayer system |
| Author(s) |
Chaochao Pan, Roger Claude, Anand P. S. Gaur, Yi Liu, Qigui Wang, Jun Cui |
| On-Site Speaker (Planned) |
Chaochao Pan |
| Abstract Scope |
Copper–graphene composites can potentially exceed the electrical conductivity of pure copper, but the relationship between graphene fraction and conductivity remains poorly quantified. Here, we synthesized 1 μm thick copper–graphene multilayer films on silicon substrates using alternating e-beam evaporation and plasma-enhanced chemical vapor deposition (PECVD). Conductivity increased monotonically across 2-, 4-, and 6-layer samples. The 6-layer sample achieved the highest performance at 108% IACS, representing a 21% relative improvement over Gr-free sample. We propose a phenomenological model based on graphene's doping effect and interface scattering to accurately describe conductivity dependence on layer spacing. Furthermore, depositing this multilayer structure onto stainless steel (SS) and aluminum substrates yielded an 8% conductivity improvement on the SS substrate. These findings provide a predictive framework for optimizing ultra-high-conductivity materials for high-efficiency battery busbars and power distribution components. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Copper / Nickel / Cobalt, |