| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Nano and Micro Additive Manufacturing
|
| Presentation Title |
Rapid and High-resolution 3D Printing of Solid or Porous Copper Parts with Tunable Nano-porosity Enabled by μCLIP and Nanoporous Copper Powders |
| Author(s) |
Natalya Kublik C, Luyang Liu, Xiangfan Chen, Bruno Azeredo |
| On-Site Speaker (Planned) |
Natalya Kublik C |
| Abstract Scope |
There is an increasing interest in 3D printing metal micro and nanoconductive structures via AM means due to their substantial potential in microelectronics and energetics. However, for material extrusion-based and layer-by-layer printing processes, both printing resolution and speed are limited due to their lateral geometry inhomogeneities and voxel-by-voxel scanning natures, respectively. Here, we develop a new metal micro-AM strategy by introducing chemically etched nanoporous copper (np-Cu) powders into a photocurable polymer matrix composite (PMC) used in a customized micro-continuous liquid interface printing (μCLIP). PMC’s metal content and rheological properties were optimized to preserve printability and printing speed, successfully printing parts with resolution of 5.8μm·pixel–1 at 10μm·s–1. Furthermore, these green parts can be sintered at temperatures as low as 46% and 64% of Cu’s melting temperature to obtain pure Cu parts with either porous (1.8×10-3Ω·m at RT) or solid (9.01×10-5Ω·m at RT) frameworks, respectively, owing to np-Cu’s size-dependent properties. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Nanotechnology, Copper / Nickel / Cobalt |