About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Fracture and Deformation Across Length Scales: Celebrating the Legacy of William Gerberich
|
| Presentation Title |
Measuring toughness at the microscale - a tribute to Bill Gerberich |
| Author(s) |
Eric D Hintsala, William M Mook, Brad L Boyce, Frank W DelRio, Douglas D. Stauffer |
| On-Site Speaker (Planned) |
Douglas D. Stauffer |
| Abstract Scope |
Local measures of strength and toughness are important for designing microstructures and devices that are resistant to failure but these experiments are more complicated in practice than their bulk counterparts. These micro-mechanical measures of local fracture toughness evolved from the indentation-based efforts of Nihara and Lawn, which can be scaled to a plasticity index using hardness and modulus acquired by high-speed mapping. Focused Ion Beam machined notched specimen fracture has progressed to quantitatively investigate local microstructure for fracture. One sample shape evolution is the pre-notched double-cantilever bending beam, which is self-arresting to allow for detailed post-mortem investigation and can be tested as a function of temperature. Secondly, a wedge loaded double cantilevered structure is presented that allows for multiple stable crack growth and arrest cycles, which enables an R-curve measurement in silicon. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Mechanical Properties, Thin Films and Interfaces, Electronic Materials |