| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Printed Electronics and Additive Manufacturing: Advanced Functional Materials, Processing Concepts, and Emerging Applications
|
| Presentation Title |
A Meshfree Phase-field Model for Simulating the Sintering Process of Metallic Particles for Printed Electronics |
| Author(s) |
Changyong C. Cao, Zhida Huang |
| On-Site Speaker (Planned) |
Zhida Huang |
| Abstract Scope |
Printed electronics are usually developed with printed electrodes from nanoparticle-based inks, which need a post-printing sintering process to enable the high conductivity required for the devices. Currently, most sintering processes in printed electronics are based on the try-and-error method or previous experience and estimation. To improve the efficiency and effectiveness of the sintering process for nanoparticle-based printed electrodes, a highly efficient numerical model and simulation method is crucial to optimize the sensing conditions for different applications to reduce manufacturing costs and save energy. In this work, we propose a meshfree phase-field sintering model using the node-material point framework implemented in Hot Optimal Transform Meshfree (HOTM) method. This framework employs the Local Maximum Entropy (LME) shape function and two optimization methods to achieve accurate predictions of void distribution and porosity in printed electronics. The sintering behaviors of both 2D and 3D cases are evaluated in comparison with experimental observation. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Electronic Materials, Modeling and Simulation |