About this Abstract |
| Meeting |
TMS Specialty Congress 2026
|
| Symposium
|
4th World Congress on High Entropy Alloys (HEA 2026)
|
| Presentation Title |
High-Throughput Design and Experimental Validation of Low-Modulus BCC High-Entropy Alloys for Next-Generation Biomedical Implants |
| Author(s) |
Lara Lima Salgado, Nelson Delfino de Campos Neto, Faith Ketcha, Taylor Unruh |
| On-Site Speaker (Planned) |
Lara Lima Salgado |
| Abstract Scope |
High-entropy alloys (HEAs) offer a promising pathway for developing next-generation biomedical implant materials capable of overcoming the stiffness mismatch inherent to conventional Ti-based alloys. This work applies HEAs design principles to engineer low-modulus body-centered cubic (BCC) solid solutions tailored for mechanical compatibility with bone. A predictive model was used to identify key elements for reducing elastic modulus while maintaining biocompatibility potential, followed by Thermo-Calc simulations to target compositions that stabilize single-phase BCC structures. To efficiently explore this design space, a high-throughput compositional-gradient thin-film library was synthesized via magnetron co-sputtering and characterized using scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS), X-ray diffraction (XRD), and nanoindentation to map composition–structure–property relationships. The most promising regions are transitioned to bulk synthesis by arc melting for mechanical validation. This approach accelerated the discovery of low-modulus HEAs and established a promising framework for developing mechanically compatible alloys for next-generation biomedical implants. |
| Proceedings Inclusion? |
Undecided |