About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
3D X-ray Imaging and Physics-based Simulation of 3D Defect Evolution in BGA Solder Joints under Thermal Cycling |
| Author(s) |
Kosuke Ando, Sundaram Vinod Kumar Anicode, Satyaroop Patnaik, Abhishek Manoj Nair, Eshan Ganju, Yaw Obeng, Erdogan Madenci, Nikhilesh Chawla |
| On-Site Speaker (Planned) |
Kosuke Ando |
| Abstract Scope |
Understanding reliability of solder joints in Ball Grid Array (BGA) packages under thermal cycling is essential for electronic devices. However, the understanding of three-dimensional (3D) damage evolution and its correlation with macroscopic applied forces and coefficient of thermal expansion remains limited. In this study, X-ray Microcomputed Tomography (XCT) was used to non-destructively characterize solder balls in corner 16x16 ball arrays of BGA packages subjected to thermal cycling. Image segmentation of the Copper pads, solder, and defects enabled both ball-level and array-level analyses. This enabled analyses of the effects of ball location, pore location, and size on damage evolution. To correlate these patterns with the local mechanical behavior, physics-based simulations were performed to capture the stress/strain distribution in solder joints and BGA packages. Our findings into how solder joint damage develops in 3D and the combination of non-destructive XCT characterization with simulation for more predictive reliability evaluation will be discussed. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |