About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Development and characterisation of In-Sn-Bi alloys designed for harsh operating environments: Overview |
| Author(s) |
Jiye Zhou, Xin Fu Tan, Stuart D. McDonald, Tetsuro Nishimura, Kazuhiro Nogita |
| On-Site Speaker (Planned) |
Kazuhiro Nogita |
| Abstract Scope |
The demand for electronic devices capable of reliable operation in extreme environments such as space exploration and quantum-computing platforms has grown substantially in recent years. With exceptional ductility at cryogenic temperatures and low melting points that facilitate low-temperature processing, indium-based alloys have attracted considerable interest. In this study, we systematically examine how the properties of various In–Sn and In–Sn–Bi alloys depend on alloy composition and microstructure. We critically evaluate the interplay of microstructural evolution, time-temperature-dependent phase transformations, solute redistribution, and strengthening mechanisms from cryogenic conditions to above-ambient temperatures, using in situ characterisation techniques. Based on these insights, we designed an In-Sn-Bi solder alloy capable of bonding circuit boards and components that can endure the severe temperature swings encountered in extreme environments. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, |