About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Microstructure-Sensitive Design and Advanced Characterization: An MPMD/SMD Symposium Honoring David T. Fullwood
|
| Presentation Title |
Virtual Aperture Electron Backscatter Diffraction for Dislocation Mapping |
| Author(s) |
Lucas Seeley, Samuel Ehrman, McLean Echlin, Tresa Pollock, Marc De Graef |
| On-Site Speaker (Planned) |
Lucas Seeley |
| Abstract Scope |
The defect structure of a GP700 CoNi – based superalloy produced via laser powder bed fusion was investigated through electron backscatter diffraction (EBSD) and electron channeling contrast imaging (ECCI). Utilizing low-voltage, fine-step-size EBSD, the complex microstructure was characterized with a dictionary indexing algorithm and simulated electron backscatter patterns (EBSPs). Strain-induced distortions in experimental EBSPs were tracked by rotating a virtual aperture across an individual feature common to all patterns in the scan region. By integrating the intensity within the virtual aperture and plotting it spatially, the strain fields outlining dislocation walls were visualized. Comparison with ECCI micrographs were then used to assess the validity of this high throughput EBSD technique for dislocation imaging. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Characterization, Additive Manufacturing, Copper / Nickel / Cobalt |