About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
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Microstructure-Sensitive Design and Advanced Characterization: An MPMD/SMD Symposium Honoring David T. Fullwood
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| Presentation Title |
A Process–Microstructure Integrated Modeling Framework for Predicting Peripheral Coarse Grain Formation in Aluminum Extrudates |
| Author(s) |
Seunghyo Hong, Eungmin Lee, Myoung-Gyu Lee |
| On-Site Speaker (Planned) |
Seunghyo Hong |
| Abstract Scope |
The peripheral coarse grain (PCG) layer is a surface microstructure in aluminum extrudates that degrades mechanical properties and corrosion resistance. Accurate prediction of PCG formation is important for extrusion process design. In this study, a process-history-based multiscale simulation framework is proposed to predict PCG layer formation. First, the extrusion process is analyzed using finite element (FE) simulations to obtain deformation and thermal histories. The deformation gradient history at selected locations is transferred to a representative volume element (RVE) for dislocation-density-based crystal plasticity finite element method (CPFEM) analysis to calculate stored energy evolution. The resulting stored energy distribution is used as input for a cellular automaton (CA) model to simulate static recrystallization and grain growth. The coupled FE–CPFEM–CA framework reproduces a coarse-grained surface layer consistent with experimental PCG characteristics. The results show that deformation heterogeneity near die-contact regions creates non-uniform stored energy distributions that influence recrystallization and govern PCG formation. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Aluminum, Computational Materials Science & Engineering, Modeling and Simulation |