About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
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| Symposium
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Material Responses Investigated Through Novel In-Situ Experiments and Modeling
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| Presentation Title |
Experimental–Numerical Micromechanical Analysis of Silicon Micro-Scratching |
| Author(s) |
Johan Hoefnagels, Sven Sperling, Tom Bertens, Kasper van den Broek |
| On-Site Speaker (Planned) |
Johan Hoefnagels |
| Abstract Scope |
As feature sizes in semiconductor devices shrink, silicon wafer processing must be optimized to reduce subsurface damage during slicing, grinding, and handling. This study presents a novel numerical–experimental framework to investigate subsurface deformation during micro-scratching. A key innovation is the Continuum Bond Method (CBM) [Sperling et al., Comp.Meth.Appl.Mech.Eng.’22; J.Mech.Phys.Sol.’24], a particle-based method with superior continuum consistency over common particle methods (e.g. SPH), while retaining robust modeling of complex fracture phenomena. CBM, combined with a large-strain inelastic constitutive model, captures phase transitions (Si-I → Si-II → Si-a), as calibrated on indentation data. In-situ SEM micro-scratch experiments enable real-time validation. Simulations reveal hydrostatic tension at sub-surface phase boundaries, supporting theories of median crack initiation. The model accurately reproduces surface recovery and subsurface transformation patterns, with strong experimental-numerical agreement of cross-sectional profiles under varying loads, providing new insights into scratch-induced damage critical for wafer thinning and defect control [Sperling et al., Int.J.Num.Meth.Eng.’24]. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Ceramics, Modeling and Simulation, Characterization |