About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials IV
|
| Presentation Title |
Electric-field assisted formation of stable one-dimentional SAC305 solder microparticle interconnects |
| Author(s) |
Gunjan Tiwari, Konrad Giżyński, Jan Paczesny, Aleksander Piasecki, Rafał Zbonikowski |
| On-Site Speaker (Planned) |
Gunjan Tiwari |
| Abstract Scope |
One-dimensional particle chains are mesoscale architectures whose structural periodicity, high surface-to-volume ratio, and strong anisotropy, make them promising building blocks for materials chemistry. However, producing continous, single-particle-thick chains with long-range continuity and mechanical stability remains challenging.
Here, we report a simple electric-field-assisted method for fabricating continuous, robust and stable 1D chains SAC305 particles. This finding prompted a deeper investigation of the governing chain formation and persistence. While dielectrophoresis is considered the primary mechanism driving particle alignment, the stability of chains after field removal indicates the presence of an additional stabilizing interaction. Systematic experiments provide evidence that this interaction is consistent with sintering between neighbouring particles.
Our results therefore distinguish field-induced alignment from post-assembly stabilization, refining the mechanistic understanding of chain formation. More broadly, thus approach offers a practical route to stable 1D particle architectures and clarifies the interactions responsible for their long-term structural integrity. |
| Proceedings Inclusion? |
Planned: TMS Journal: Journal of Electronic Materials |
| Keywords |
Electronic Materials, Shaping and Forming, Other |