About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Mechanism of Cu Addition in Suppressing Continuous Void Formation at the Sn12In2Zn4Bi/Cu Interface during Thermal Aging |
| Author(s) |
Yung Hsin Lu, Yu Hsin Lin, C. Robert Kao |
| On-Site Speaker (Planned) |
Yung Hsin Lu |
| Abstract Scope |
Solders are widely used in electronic packaging, where their microstructure, mechanical properties, and reliability are critical to overall performance. The commonly used Sn-Bi solder suffers from coarsening of the Bi phase during thermal aging, which adversely affects its mechanical properties. Therefore, this study adopts Sn-In-based solder as the main system and investigates the interfacial reactions between Sn12In2Zn4Bi solder and copper substrate. It was found that continuous voids form above the intermetallic compound (IMC) layer during prolonged thermal aging. This research through microstructural analysis explores the effect of adding Cu element into the solder to reduce the Cu concentration gradient, thereby preventing excessive Cu diffusion from the interface into the solder and ultimately suppressing the formation of continuous voids. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Characterization |